|
Heat Sink Technology 
A heat sink is a physical device, used in electronic circuits, to assist bulk heat dissipation by conduction and convection. On circuit boards, the heat sink assembly usually consists of a flat metal body (in aluminum or copper) protruding up from the board, often bonded to a metal fin structure that reduces the thermal resistance to air. Depending of the size, shape, and material, the heat sink design absorbs and dissipates at various level of performance the excess heat generated by a system.\Copper is far more efficient than Aluminum for absorbing the heat. It is also far more expensive. Today’s semiconductors are so fast that it becomes more and more complex to design heat sink that can efficiently absorb and dissipate the heat they generate. Most PC manufacturers have to move from aluminum to copper, which results in significant increase in costs.
Tandis has invented and patented a new heat sink technology called “accordion fin.” It consists of folding very thin sheets of aluminum or copper metals in the shape of an accordion fin. The purpose is to maximize the surface area in contact with the air flow. It has also the advantage of minimizing the use of metal, consequently dramatically reducing the cost of the heat sink. Thanks to this new technology, all aluminum and copper heat sinks become more efficient (more surface area to absorb and dissipate the heat) and less expensive (less metal used).
The manufacturing of such accordion fin heat sink is easy, fully customizable, and highly automated for any size, shape, and material. The folded fins can be attached to a base of copper or aluminum of varying thickness, to meet your performance and weight requirements. The fins are attached to the base using either a high performance thermal compound or solder.
Products applications include PCs, motor controller, automotive heating and air-conditioning.
|
